TSMC plans to increase monthly 2nm wafer capacity from 90,000 to 110,000 by mid-2026 (22% rise) and 3nm capacity from 120,000-130,000 in late 2025 to 210,000 by mid-2027 (about 70% increase). The foundry is also adding 3nm facilities in Taiwan, Arizona, and Japan, converting some 5nm lines, and expanding CoWoS advanced packaging at its Zhubei Plant 7, with 2027 revenue projected to hit a record. For a financial institution, the data point confirms that advanced-node supply for AI chips continues to scale rapidly, reinforcing hyperscaler capex deployment assumptions.
81 other tracked developments touching the same claims.