Global AI venture capital reached $100 billion in 2024, up 80% year over year, driving a historic inflection in advanced chip packaging investment. Asia-Pacific advanced packaging capacity has quadrupled in two years, and TSMC's CoWoS capacity is fully booked through 2026, while governments worldwide are investing billions to secure domestic packaging supply. For financial institutions, this signals a structurally tight and geopolitically significant supply node that could affect AI infrastructure deployment timelines and costs.
81 other tracked developments touching the same claims.