Reuters reports TSMC is considering Texas as an additional US manufacturing base alongside its $265 billion Arizona commitment, with deliberations at an early stage and no confirmed plan. Separately, an SEC filing shows the board approved fresh capital allocations, SK Hynix validated HBM5 on TSMC's CoWoS platform, and TSMC is reportedly adding five advanced packaging plants in Chiayi plus the Kaohsiung industrial park, driven by AI accelerator demand where packaging has repeatedly been the limiting output constraint. For financial institutions, this corroborates advanced packaging as the tightest supply node in the AI compute chain and adds a large unconfirmed capex item to the aggregate build-out pipeline.
193 other tracked developments touching the same claims.