TrendForce projects HBM demand to grow 130%+ YoY in 2025 and 70%+ in 2026, driven by AI accelerator spec escalation across NVIDIA, AMD, and Google platforms, while the shift toward AI inference workloads is simultaneously accelerating DDR5 server deployment by North American CSPs. Constrained fab capacity, with the three major DRAM manufacturers prioritizing HBM and high-end server DRAM, is squeezing consumer DRAM supply and pushing overall DRAM contract prices up more than 70% in 2026, creating a seller's market expected to persist through the year. For financial institutions, this underscores HBM and advanced packaging as a structurally tight supply node with sustained pricing power, while downstream consumer electronics OEMs face meaningful margin compression and downward shipment revisions.
283 other tracked developments touching the same claims.