Deloitte's 2026 TMT Predictions identify a broadening set of semiconductor supply chain chokepoints, including EUV lithography, GAAFET-based EDA tools, HBM co-packaging, and precision etch equipment, now subject to or imminently facing export controls, with at least $30B in affected critical technology spend projected for 2026. The controls are accelerating a bifurcation between allied-country fabs (advancing to 1.8 nm by 2026–27) and China (constrained to mature DUV nodes with multi-patterning workarounds), while chiplet-based packaging, estimated at $100–110B in 2026 revenues, is flagged as an emerging geopolitical chokepoint. For financial institutions, supply chain delays in advanced packaging and OSAT clearances could materially disrupt the rollout timeline of AI data centers against the backdrop of ~$500B in projected 2026 AI infrastructure spend, creating execution risk in capex-dependent AI investment theses.
377 other tracked developments touching the same claims.